Group 1 - Minimum of 90 credits/Maximum of 120 credits :
Full Year
Imaging Principles & Technology Project(光学成像原理和技术) 30 credits*
Intergrated Photonics: Design & Technology(集成光子学设计技术)30 credits
Photonic Communications Components (光通信元件)30 credit
Optical Communications with project (光通信项目) 30 credits
Research Techniques in Advanced Electromagnetics(研究先进电磁学技术)30 credits
Group 2 - Maximum of 30 credits
Autumn Semester
Instrumentation & Measurement (仪表和测量) 10 credits
Instrumentation & Measurement with project (仪表和测量项目) 20 credits
Spring Semester
Digital Signal Processing for Telecommunications, 20 credits
Multimedia & Instrumentation with project (无线电,多媒体和仪表的数字信号处理项目)
Digital Signal Processing for Telecommunications, 10 credits
EMultimedia & Instrumentation (无线电,多媒体和仪表的数字信号处理)
RF Microelectronics (射频微电子) 10 credits
Microelectronics with project (射频微电子项目) 20 credits
Mobile Communications (移动通信) 10 credits
Mobile Communications with project (移动通信项目) 20 credits
利物浦的
Introduction to Laser Materials Processing (激光材料处理介绍)
Optics & Optical Effects(光学和光学效应)
ELaser Welding (激光焊接)
Economics of Laser Engineering (激光工程经济学)
Rapid Prototyping (快速铸型)
Laser Cutting (激光切割)
Laser Surface Processing (激光表面处理)
Laser Microprocessing (激光微处理)
Smart Materials (智能材料)
Research Skills, Planning & Development
Personal and Employability Skills